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Nantong Meijing Micro Electronics Co., Ltd.

Nantong Meijing Micro Electronics Co., Ltd. Kunshan Microform Tech Co., Ltd.

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Semiconductor bump planting process
Semiconductor bump planting process

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0201Influence of components on manufacturing process-3
0201Influence of components on manufacturing process-3

for the 0201 element, the opening area of the template is reduced as the size of the pad is reduced. this leads to a decrease in the area ratio. when the template design of 0201 com…

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0201Influence of components on manufacturing process-2
0201Influence of components on manufacturing process-2

1.20201 influence on printing processin the process of smt production, the printing of solder paste is usually the first step and the most critical process. because statistics show …

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Introduction to characteristics of non woven nickel wire mesh
Introduction to characteristics of non woven nickel wire mesh

this new type of metal mesh by electroforming technology produced in the most advanced, non woven characteristics to overcome the traditional screen at the junction of latitude and …

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Present status and future prospects of halftone technology
Present status and future prospects of halftone technology

in the field of surface mount assembly, the stencil is the key to achieving precise and repeatable solder paste coating. as the solder paste is printed through the stencil perforati…

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Design an ideal wafer bumping process
Design an ideal wafer bumping process

at present, there are several technologies available for coating solder paste on wafer pads. this technique is called wafer bumping technology. the use of halftone printing for wafe…

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Wafer bumping; stencil printing; design considerations
Wafer bumping; stencil printing; design considerations

basic design items that affect the printing effect of wafer bumping screen boardprefacea number of important design factors must be considered in order to ensure that the wafer to w…

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The influence of 0201 elements on the manufacturing process
The influence of 0201 elements on the manufacturing process

the influence of 1 and 0201 components on pcb designthe application of 0201 component has a great influence on the design and manufacture of printed circuit board. its main influenc…

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SMT Fine pitch Stencil design
SMT Fine pitch Stencil design

stencil design and solder paste selection in smt high density and fine pitch assemblyprefacewith the development of smt towards fine spacing components, the density of smd package…

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