Wafer Bump Stencil_High precise EF Stencil_Nantong Micro-eform Tech Co., Ltd

Product Classification

Hotline：

0512-57906238

Tel：13656269491

Fax：0512-57906239

Mail：mef@micro-ef.com

Addr：No. 189, ZhangJi Road Kunshan City ,China

Location：Home > Product > High precise EF Stencil

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High Precise Stencil for Wafer Bumping process

HotLine：0512-57906238

Details

Product introduction

4 ~12 inch wafer bump package ball template

IC plate, PAD bump package, implant template

The ball diameter is 50 ~ 350um

It covers all package forms such as SIP system package, WLP wafer packaging, FC flip chip and so on

Chip 3D package perfect solution

Use	IC Carrier plate bump package	Wafer chip bump packaging
manufacturing method	Electroforming（electroforming）	Electroforming（electroforming）
Texture of material	Ni alloy	Ni alloy
Maximum template size	800×800mm	800×800mm
Thickness range	0.02～0.2 mm	0.02～0.35mm
Width thickness ratio	0.02～0.10 → ±0.003mm 0.11～0.20 → ±0.005mm	0.02～0.10 → ±0.003mm 0.11～0.20 → ±0.005mm
Width thickness ratio	Picture thickness: board thickness＝1：1	Graphic width: board thickness＝1：1.5
Opening accuracy	Specified value±0.005mm	Specified value±0.005mm
Length accuracy	±0.015mm	±0.015mm
Graphic film	High precision DPI film	High precision DPI film
Net frame	Aluminum alloy (hollow)	Cast aluminium, cast iron, heavy aluminum, etc.
Tension	1.0～1.2mm　※STG-75Determination of value	0.75～0.80mm　※STG-75Determination of value

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