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Nantong Micro-eform Tech Co., Ltd

Nantong Micro-eform Tech Co., Ltd Kunshan Micro-eform Tech Co., Ltd.

Hotline: 0512-57906238

Search: SMTWafer3D

Contact Us
Hotline:

0512-57906238

Tel:13656269491

Fax:0512-57906239

Mail:mef@micro-ef.com

Addr:No. 189, ZhangJi Road Kunshan City ,China

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TitleWafer Bump Stencil

Hits:273

High Precise Stencil for Wafer Bumping process

HotLine:0512-57906238

Product introduction


4 ~12 inch wafer bump package ball template

IC plate, PAD bump package, implant template

The ball diameter is 50 ~ 350um

It covers all package forms such as SIP system package, WLP wafer packaging, FC flip chip and so on

Chip 3D package perfect solution



Technical parameter 

Use

IC Carrier plate bump package

Wafer chip bump packaging

manufacturing method

Electroforming(electroforming)

Electroforming(electroforming)

Texture of material

Ni alloy

Ni alloy

Maximum template size

800×800mm

800×800mm

Thickness range

0.02~0.2 mm

0.02~0.35mm

Width thickness ratio

0.02~0.10 → ±0.003mm
0.11~0.20 → ±0.005mm

0.02~0.10 → ±0.003mm
0.11~0.20 → ±0.005mm

Width thickness ratio

Picture thickness: board thickness=1:1

Graphic width: board thickness=1:1.5

Opening accuracy

Specified value±0.005mm

Specified value±0.005mm

Length accuracy

±0.015mm

±0.015mm

Graphic film

High precision DPI film

High precision DPI film

Net frame

Aluminum alloy (hollow)

Cast aluminium, cast iron, heavy aluminum, etc.

Tension

1.0~1.2mm ※STG-75Determination of value

0.75~0.80mm ※STG-75Determination of value

Product picture

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