0512-57906238
Tel:13656269491
Fax:0512-57906239
Mail:mef@micro-ef.com
Addr:No. 189, ZhangJi Road Kunshan City ,China
3D EF stencil for all SMT print ( Step Up,Step Down, COB)
The combination of microelectronics technology electroforming technology advantage in technology, for customers to design and manufacture all kinds of special specifications 3D electroforming template, meet the diverse needs of customers; adopts the unique VTS technology step variable thickness template, making STEP UP/DOWN electroforming template, no cracking or delamination is not good, and does not damage the surrounding elements and effect of printing scraper.
Thinning process of traditional laser plate thickening, using laser etching + technology, the pollution of the environment, not only the Step Down regional opening burr, and printing surface roughness caused by adverse effects of printing film, solder paste printing precision components. The unique technology of electroforming Step steel plate ensures the smooth quality of the opening of the precise component, ensures the better surface of the steel plate, and ensures the quality of the precision printing. (as below)
With its unique electroforming patent technology, the company produces a variety of COB electroforming steel plates, with the highest COB cover reaching 2.5mm, which meets the special printing needs of customers. The 3D structure made of laser steel plate has poor contraposition accuracy, and the solder paste is easy to leak and pollute the PCB. While the electroforming 3D steel plate is integrated with COB, which has high precision and can guarantee the requirement of batch precision printing.