http://en.micro-ef.com/news/ zh-cn Rss Generator By 3.0 biz#20200101 http://en.micro-ef.com/industry/107.html the electroformed steel plate is made of composite design, designed for various sizes, specifications and printing materials to design the size and arrangement of various openings.]]> http://en.micro-ef.com/industry/106.html the basic characteristics of solar cells include the polarity of solar cells, the performance parameters of solar cells, and the three basic characteristics of solar energy, environmental protection and volt ampere characteristics of batteries. specific explanations are as follows
1. polarity of solar cells
the general structure of type p+/n or n+/p type structure of silicon solar cells, p+ and n+, said solar cell front light conductive type semiconductor material layer; n and p, said conductive type semiconductor material on the back substrate of solar cell. the electrical properties of solar cells are related to the properties of the semiconducting materials used in the manufacture of batteries.
2. performance parameters of solar cells
the performance parameters of a solar cell are composed of open circuit voltage, short circuit current, maximum output power, fill factor, conversion efficiency, etc.. these parameters are a sign of the performance of solar cells.]]> http://en.micro-ef.com/industry/104.html classification
1 silicon solar cells;
2, inorganic salts such as gallium arsenide, iii-v compounds, cadmium telluride, cadmium sulfide, copper indium selenide and other compounds as materials of the battery;
3. solar cells prepared by functional polymer materials;
4, nanocrystalline silicon solar cells.]]> http://en.micro-ef.com/industry/45.html at present, there are 5 kinds of mature process technology which can be used for wafer bumping. each technique has its own advantages and disadvantages. the gold stud welding bumps and electrolytic or electroless gold welding bumps are mainly used for encapsulation with less pin number. the application areas include glass flip chip package, soft film flip chip package and rf module. because of the high cost and long process time of this kind of technology, it is not suitable for the package with more i/o pins. another technique is to solder the preform before reflow soldering the preformed solder ball, which is suitable for packages with pins up to 300. the most widely used two kinds of wafer bumping processes are electrolytic or electroless solder and printed solder paste using high-precision lithography platforms.
one of the advantages of printed paste is that equipment investment is low, which allows many wafer manufacturers to enter the market and serve the semiconductor manufacturers. with the gradual acceptance of wlp for the commercial market, the demand for new wafer projection professional processing services continues to grow rapidly.
practical process development
many emerging applications required bump less in quantity, the key requirements of the application is the solder bump must have large cross section, in order to reduce the resistance of no bare chip package, because the on resistance of the device is mainly from the dfpr ron, it will ultimately affect the product efficiency and battery life.
recently, europe launched a development plan of solder ball stick planting technology, can make the application of wlp in vertical power mosfet, compared with the standard to package can reduce 30% of the package and occupying area of 90% dfpr. it is funded by the european union, the goal is to develop the next generation of wlp packaging devices wireless portable applications in local area network, including soc power amplifier and a short-range wireless networking baseband equipment required to achieve a high degree of miniaturization.]]> http://en.micro-ef.com/industry/44.html as the core of spectrum instrument, grating fabrication and application level directly affect the development of spectrum instrument industry. at present, the research institutions engaged in grating manufacturing technology in china are only a few of changchun institute of optics and optics, tsinghua university and university of science and technology of china, and lack of investment and long-term planning. metrology grating manufacturing has been widely used in precision measurement, automatic positioning, tracking test and optical information processing. the quality of grating manufacturing, the accuracy, the cost and the manufacturing efficiency will directly affect the accuracy and performance of grating manufacturing measuring instruments.
the grating encoder can be pided into two major categories, one is the rotary encoder, which is used for the measurement of rotation angle and speed; two, the ruler type encoder is used for the measurement of the linear displacement and the speed of movement. in the rotary encoder, it can be pided into absolute encoder and incremental encoder.]]> http://en.micro-ef.com/industry/43.html the technical background of voice coil motor (voice coil motor) vcm, has the advantages of small volume, low power consumption and low price, suitable for electronic products (such as digital camera, mobile phone, digital camera etc.) in the actuator (see design of a voice coil motor used in the focusing system of a digitalvideo camera, magnetics ieee transactions, on volume 41, issue 10, oct. 2005page (s): 3979-3981). with the rapid development of electronic product technology, the requirement of automatic focusing for electronic products is becoming higher and higher. vcm shrapnel plays an important role in automatic focusing. at the same time, the vcm shrapnel requires high machining accuracy, and the smaller the size tolerance of vcm shrapnel, the better the autofocus effect. therefore, how to improve the quality of vcm shrapnel has become an important problem to be solved urgently by technicians in this field.
the utility model solves the technical problem of the utility model is to provide a vcm shrapnel, technical problem solved by the utility model to achieve a vcm spring plate adopts the following technical scheme, shrapnel has a flat, geometric center plate is provided with a through hole, the through hole to make it through the lens light through shrapnel flat; has a through hole around and away from the hole and a frame around the hole and the elastic part near the hole in the box and is located between the outer and inner frame of the frame; the four corners are respectively provided with a positioning hole, and the inner frame contact site set to the wave shape along the longitudinal center plate frame; symmetrical line one pides into two. state of separation; the inner frame plate is arranged horizontally along the center line two toward the through hole and through hole connecting convex, flat along the center line longitudinal opening two toward the through holes and the through hole is connected with the mouth and two long short convex concave convex toward the frame while facing the through hole and through hole connecting port, the inner frame and the longitudinal plate along the center line from one pides into two. is antisymmetric state of separation, the same side of the separation of the inner frame and the outer frame are connected with each other. in the utility model, the production of vcm photochemical etching technology of shrapnel, photochemical etching can guarantee vcm shrapnel flatness; structure change by photochemical etching etching liquid chemical composition and etching equipment, achieve higher machining precision. in the utility model, the vcm fragment by mx215, is a high nickel tin copper alloy, five alloy containing ag, pt, au, ni, cu and other precious metals, is the most excellent electrical contact materials, conductive ability, stable contact resistance, corrosion resistance, high reliability, strong elasticity. in the utility model, the production of vcm photochemical etching technology of shrapnel, photochemical etching technology is the core ratio, adjust and control the etching solution composition, etching liquid consumed fe3+ is adjusted by adding some dynamic chemical etching, the control speed is constant, the higher dimensional precision etching parts. in the utility model, the production of vcm photochemical etching technology of shrapnel, increase filter system in traditional exposure system, and the photosensitive film reacts with light into parallel light; the nozzle spraying system arrangement of etching to cross arrangement, boom angle from 90 degrees to 60 degrees, and instead of single control pressure; increase the circulation system of etching solution in apparatus. the beneficial effect of the utility model adopts the high nickel tin copper alloy material with conductive ability, stable contact resistance, corrosion resistance, high reliability, flexibility than beryllium bronze; by photochemical etching technology in the production process to ensure the smoothness of the vcm shrapnel through structural change; photochemical etching etching solution and etching chemical composition the equipment, to achieve higher machining precision; in order to improve the quality of the vcm shrapnel smell.]]>